Higher Education Loans and Scholarship Board

Invitation for Bids (IFB).

Tender No. HELSBPC01/G/06/2021 Supply and Delivery of Various Software Licences

The Higher Education Loans and Scholarships Board has provided funds in the budget year 2021 for the purchase of various software licenses for the Higher Education Loans and Scholarships Board Students Financing Management System (HESFMS) hosted on Cloud services and incorporating both mobile and web-based end-user services. The Higher Education Loans and Scholarships Board now invite sealed bids from eligible bidders to tender for the supply and Delivery of various software licenses.

Interested eligible bidders may obtain further information and inspect the bidding documents at the Higher Education Loans and Scholarships Board, Procurement and Supplies Unit, Higher Education Loans and Scholarships Board 2nd Floor United Church House, 8 Mosi-O-Tunya Road Woodlands, Lusaka, Zambia. HOWEVER, TELEFAX OFFERS WILL NOT BE ACCEPTED.

A complete set of bidding documents may be purchased by interested bidders upon payment of a non-refundable fee of K500.00.

Submission Procedure

Bids should be sent clearly marked "Tender for the supply and Delivery of various software licenses" addressed to the Higher Education Loans and Scholarships Board, 2nd Floor, United Church House, 8 Mosi-O-Tunya Road Woodlands, Lusaka Zambia and must be sent not later than Thursday, 29th July, 2021 at 10:30 hours local time.

Bids must be deposited in the Tender Box at the Higher Education Loans and Scholarships Board, Ground Floor, United Church House, 8 Mosi-O-Tunya Road Woodlands, Lusaka Zambia and must be sent on or before than Thursday, 29 July, 2021 at 10:30 hours local time and must be accompanied by a bid security of not less than two percent (2%) of the bid price or Bid Securing Declaration, duly signed and sealed by the Guarantor(s).

The closing date for the receipt of bids is than Thursday, 29th July, 2021 at 10:30 hours local time and any bid received after the time and date stipulated above will not be accepted. The bids will be opened soon after closing in the Conference Room, in the presence of bidders or their representatives who choose to attend.

Ireen N. Chirwa (Mrs.)
Chief Executive Officer
HIGHER EDUCATION LOANS AND SCHOLARSHIPS BOARD